Compared with thru-hole mounting procedure, area mounting procedure stands out when it comes to producing performance because it functions a totally automatic mounting PCB assembly process from solder paste printing, decide on and place and reflow soldering.
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Stage 1: Solder paste printing - Solder paste is applied over the board by way of a solder paste printer. A template guarantees that solder paste is usually correctly still left on appropriate places where by elements will probably be mounted, which is also known as stencil or solder monitor. Simply because top quality of solder paste printing is right associated with top quality of soldering, PCBA brands concentrating on high quality products and solutions typically perform inspections just after solder paste printing via a solder paste inspector. This inspection assures printing has reached rules and requirements. If problems are located on solder paste printing, printing needs to be reworked or solder paste will be washed off prior to second printing.
Action two: parts Mounting - After coming out of solder paste printer, PCB will likely be auto-sent to pick-and-place equipment where parts or ICs will likely be mounted on corresponding pads from the influence of tension of solder paste. Factors are mounted on PCB board as a result of part reels during the equipment. Much like film reels, element reels carrying components rotate to offer areas to the device, that may quickly stick components to the board.
Stage 3: Reflow Soldering - Right after each and every ingredient is positioned, the board passes through a 23-foot-long furnace. A temperature of 500°F brings about the solder paste to liquefy. Now the SMD parts are bound firmly towards the board.