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X-ray inspection of BGA,

nikon metrology marketplace electronic bgaWith the advent of numerous more recent variety components these kinds of as BGA and flip-chip gadgets; regular microscope inspection just isn't a possibility because the bulk of solder connections to your PCB are concealed from see. As such real-time X-ray photographs turn into a lot more significant than ever before just before.;

Soldering imperfections drop to the pursuing groups:

The x-ray machine's high repeatability accuracy serves to boost production. The unique angle for sample inspection also makes it suitable for mass testing.

Dry joints due to inadequate solder

Bridging/Shorts because of to surplus solder

Voiding because of to gasoline bubbles in the solder

Misplacement/Misalignment because of to inaccurate placement of elements

The ease of looking at these flaws is determined by the impression resolution. Defects as bridging and gross misalignment, are detectable with microscpes. Some others, these types of as voiding, requires X-ray with a resolution down to one micron, and electric power in surplus of 100W, especially for devices such as micro-BGAs.

To detect dry joints high resolution (1 micron) superior magnification (100X to five.000X), advanced sample manipulation (to tilt and rotate the PCB or perhaps the imaging program), and complex image-processing application is needed. XT V programs mix all these into a single pretty user-friendly procedure. Specific techniques can be found with CT choice for a full 3D insight in to the electrical components.

Wide selection of makes use of

Any OEM and supplier of electronic subsystems in client electronics, automotive, aerospace can enrich its inspection system by adopting X-ray and CT inspection techniques.

Digital and electrical elements

Broken wedge bonds

Lifted ball bonds

Wire sweep

Die attach

Populated and unpopulated PCBs

Check out floor mount flaws i.e. misaligned units, solder joint porosity, bridging

Comprehensive inspection of vias, through gap plating and multi-layer alignment

BGA and CSP inspection

Non-lead solder inspection.

related articles:

X-ray inspection of BGA, wirebonds, MEMS, loaded PCB

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